China’s JCET to build new plant in Shanghai to expand advanced chip packaging (opens original article in a new tab)

China's JCET will invest 7.8 billion yuan to build a new advanced chip packaging plant in Shanghai's Lin-gang Special Area, aiming to expand its high-end packaging capacity amid growing demand for domestic chips.

• JCET to invest 7.8 billion yuan to build new plant in Shanghai's Lin-gang Special Area.
• Project will expand advanced chip packaging and testing capacity in two phases, with first phase ending 2028.
• Advanced packaging is critical for China's chipmaking as export controls limit access to advanced foundries.