TSMC, Amkor sign 10-year deal to boost advanced chip packaging in US (opens original article in a new tab)

TSMC and Amkor have signed a 10-year deal to enhance advanced chip packaging and testing in the US, focusing on Arizona's semiconductor supply chain to meet growing AI and high-performance computing demands.

• TSMC and Amkor sign 10-year agreement to expand advanced chip packaging and testing in US
• Collaboration aims to strengthen semiconductor supply chain in Arizona for AI and high-performance computing
• TSMC's Arizona facilities include three fabs with plans for additional investments