Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push (opens original article in a new tab)

Intel named Seok-Hee Lee to lead its foundry packaging efforts as it strengthens contract manufacturing partnerships and advances chip packaging technology.

• Intel appointed Seok-Hee Lee as executive vice president of its contract chip-manufacturing division.
• Lee will lead advanced packaging, system integration, and back-end technology development.
• Intel's focus on advanced packaging follows Apple's agreement to work with the company on U.S. chip design and manufacturing.