Intel hires former SK hynix chief Lee Seok-hee to lead advanced packaging (opens original article in a new tab)

Intel has appointed Lee Seok-hee, former SK hynix and SK On CEO, as a senior vice president in its foundry business to lead advanced packaging and system integration efforts.

• Intel appointed Lee Seok-hee, former SK hynix and SK On CEO, as senior vice president in its foundry business.
• Lee will lead advanced packaging, system integration, and back-end technology development at Intel Foundry.
• Intel aims to strengthen its foundry business by enhancing manufacturing and advanced packaging capabilities for AI systems.