IBM hails new 'block of flats' design breakthrough for ultra tiny chips (opens original article in a new tab)

IBM introduces a 0.7nm chip design with 3D stacking technology, offering 50% better performance and 70% improved energy efficiency compared to its 2nm chip, marking a significant advancement in chip manufacturing.

• IBM unveils new chip design with 0.7nm technology, enabling 100 billion transistors on a fingernail-sized chip
• IBM's NanoStack architecture uses 3D stacking to improve performance by 50% and energy efficiency by 70% compared to 2nm chips
• Experts compare IBM's 3D chip design to a 100-story skyscraper, contrasting with rivals' 30-50 story structures