ZTE showcases full-stack AI capabilities at MWC Shanghai 2026, empowering new era of token operations (opens original article in a new tab)

ZTE presented AI solutions at MWC Shanghai 2026, emphasizing token efficiency, AIOS platform, and 6G connectivity innovations to drive AI infrastructure development.

• ZTE showcased TCO-optimal AI factory at MWC Shanghai 2026 to enhance token efficiency and reduce costs
• ZTE introduced AIOS and Co-Claw platform for smarter token scheduling and closed-loop services
• ZTE demonstrated 6G solutions including GigaMIMO and 256 TR U6G prototype to enable intelligent connectivity
• ZTE focused on AI integration with networks through AIR MAX and AI HI-NET solutions for efficient token circulation